Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
Tuesday, May 6, 2008 - 13:42
in Physics & Chemistry
Intel Corp., Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.