ARM Announces 45nm SOI Test Chip Results That Demonstrate 40 Percent Power Savings Over Bulk Process
Thursday, October 8, 2009 - 12:14
in Physics & Chemistry
ARM announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing chips. The test chip was based on an ARM 1176 processor and enables a direct comparison between SOI and bulk microprocessor implementations. The results confirm SOI technology is a viable alternative to traditional bulk process technology when designing low-power processors for high-performance consumer devices and mobile applications.