Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Thursday, November 5, 2009 - 14:07
in Mathematics & Economics
Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and mobile devices.