New materials for electronic packaging: Researchers improve energy costs in chip-making
Tuesday, January 19, 2010 - 14:07
in Physics & Chemistry
Carnegie Mellon University and Intel Corporation will unveil a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. The milestone research will be discussed at the 11th annual Magnetism and Magnetics Materials Conference Jan. 18-22 at the Marriott Washington Wardman Park in Washington, D.C.