Applied Materials Introduces Critical Via Liner Technology for 3D Chip Packaging
Tuesday, March 30, 2010 - 16:49
in Physics & Chemistry
Applied Materials, Inc. today added to its extensive line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a unique CVD process, the InVia system delivers an innovative method for depositing the critical oxide liner film layer in high aspect ratio (HAR) through-silicon via (TSV) structures. Providing conformal coverage over the full depth of these challenging features, the InVia process enables robust electrical isolation of the TSV - which is vital for reliable device performance.