SEMATECH Technologists Detail Process Advances to Accelerate 3D Manufacturing Readiness
Wednesday, April 21, 2010 - 14:00
in Physics & Chemistry
With a focus on providing cost-effective and reliable solutions to speed manufacturing readiness of 3D technology options, experts from SEMATECH's 3D interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex outlined new developments in wafer bonding, copper removal, and wafer thinning at the 2010 Materials Research Society (MRS) Spring Meeting on April 5-9 in San Francisco, CA.