Ralink Unveils Next-Gen Dual-Band 2x2 802.11n/Bluetooth 3.0+HS Combo Module
Tuesday, June 1, 2010 - 18:30
in Physics & Chemistry
Ralink Technology, a developer of high performance wired and wireless networking solutions, today announced the RT3592BC8, the world's only chipset capable of simultaneous 300 Mbps 2x2 MIMO dual band 802.11n and Bluetooth 3.0+HS operation. The half MiniCard solution for PCs, notebooks, netbooks and connected mobile devices delivers an unprecedented level of performance and intelligent coexistence between Wi-Fi and Bluetooth.