Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications
Tuesday, July 12, 2011 - 13:30
in Physics & Chemistry
Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imecs applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs.