Samsung develops 30nm-class 32GB green DDR3 for next-generation servers
Thursday, August 18, 2011 - 05:30
in Mathematics & Economics
Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.