3M and IBM to develop new types of adhesives to create 3D semiconductors
Thursday, September 8, 2011 - 08:01
in Physics & Chemistry
3M and IBM announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon towers. The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips.