NXP introduces first 2-mm x 2-mm MOSFETs with tin-plated solderable side pads
Friday, June 15, 2012 - 08:01
in Mathematics & Economics
NXP Semiconductors today introduced the industrys first MOSFETs in a 2-mm x 2-mm low-profile DFN (discrete flat no-leads) package with tin-plated, solderable side pads. These unique side pads offer the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages.