Scientists develop revolutionary nanotechnology copper solder
Thursday, October 25, 2012 - 10:30
in Physics & Chemistry
(Phys.org)—Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 °C. Once fully optimized, the CuantumFuse solder material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use. Applications in military and commercial systems are currently under consideration.