Boosting heat transfer with nanoglue

(Phys.org)—A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. Results of the team's study, published in the journal Nature Materials, could enable new advances in cooling computer chips and lighting-emitting diode (LED) devices, collecting solar power, harvesting waste heat, and other applications.

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