Computer model provides important clues for the production of tightly packed electronic components

Greater numbers of ever-smaller components are required to fit on computer chips to meet the ongoing demands of miniaturizing electronic devices. Consequently, computer chips are becoming increasingly crowded. Designers of electronic architectures have therefore followed the lead of urban planners and started to build upward. In so-called 'three-dimensional (3D) packages', for example, several flat, two-dimensional chips can be stacked on top of each other using vertical joints.

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