Innovative 3-D integration technology could improve industrial processes
Wednesday, August 7, 2013 - 06:00
in Physics & Chemistry
The latest gadgets hitting the market are smaller and faster than ever before, and rapidly-emerging 3D integration technology plays a major role in this evolution. The process, which consists in stacking 2D dies and connecting them in the 3rd dimension in order to speed up communication between chips, can be found in appliances such as miniaturised implantable medical devices and radio frequency devices found in mobile phones. It stacks and interconnects multiple materials, technologies, and functional components to form highly integrated micro and nanosystems for cross-sector applications.