Scientists develop new technique for polishing surfaces at the nanoscale
Thursday, July 28, 2016 - 05:31
in Physics & Chemistry
Currently, the main method of obtaining smooth surfaces in industry is chemical-mechanical or "wet" polishing. However, this has two disadvantages: Most methods leave a residual pattern at the scale of about 1 nm, as well as a defective near-surface layer. Moreover, removing imperfections from the surface of manufactured semiconductor plates, a process called "wet planarization," requires breaking vacuum conditions.