Ultra-thin Chip Embedding For Wearable Electronics
Tuesday, March 10, 2009 - 09:21
in Physics & Chemistry
Technologists have created a new 3D integration process enabling flexible electronic systems with a thickness of less than 60 micrometer. This ultra-thin chip package (UTCP) technology allows integrating complete systems in a conventional low-cost flex substrate. This paves the way to low-cost, unobtrusive wearable electronics for e.g. wearable health and comfort monitoring.