Slimmer, Stickier Nanorods Give Boost to 3-D Computer Chips
Tuesday, March 17, 2009 - 12:31
in Physics & Chemistry
Researchers at Rensselaer Polytechnic Institute have developed a new technique for growing slimmer copper nanorods, a key step for advancing integrated 3-D chip technology. These thinner copper nanorods fuse together at about 300 degrees Celsius. This relatively low annealing temperature could make the nanorods ideal for use in heat-sensitive nanoelectronics, particularly for "gluing" together the stacked components of 3-D computer chips.