Cracking a Tough Nut for the Semiconductor Industry

(PhysOrg.com) -- Researchers at the National Institute of Standards and Technology have developed a method to measure the toughness -- the resistance to fracture -- of the thin insulating films that play a critical role in high-performance integrated circuits. The new technique could help improve the reliability and manufacturability of ICs and, better yet, it`s one that state-of-the-art microelectronics manufacturers can use with equipment they already own.

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