Bonding Chips Using InkJet Printers
Tuesday, March 14, 2017 - 11:32
in Physics & Chemistry
A team of researchers at the University of Barcelona have demonstrated a new bonding technique for surface mounted devices that uses an inkjet printer with ink that incorporates silver nanoparticles. The technique, described this week in the Journal of Applied Physics, was developed in response to the industrial necessity for a fast, reliable and simple manufacturing process, and with an eye to reducing the environmental impact of the standard fabrication processes.