Making wafers faster by making features smaller

The manufacturing of semiconductor wafers used in all types of electronics involves etching small features onto a wafer with lasers, a process that is ultimately limited by the wavelength of the light itself. The semiconductor industry is rapidly approaching this fundamental limit for increasing the speed of the microchip. The development of a new intense 13.5-nm (extreme ultraviolet or EUV) light source will resolve this issue by reducing the feature size by an order of magnitude or so, according to Purdue researchers in the Journal of Applied Physics.

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