Carbon nanotubes best for 3D electronics
Monday, December 12, 2011 - 09:02
in Physics & Chemistry
(PhysOrg.com) -- Researchers at Chalmers have demonstrated that two stacked chips can be vertically interconnected with carbon nanotube vias through the chips. This new method improves possibilities for 3D integration of circuits, one of the most promising approaches for miniaturization and performance promotion of electronics.