3-D self-assembling structures could lead to new microchips, other devices (w/ Video)
Friday, June 8, 2012 - 04:30
in Physics & Chemistry
Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.