NXP releases smallest, toughest power MOSFETs
Monday, June 18, 2012 - 10:01
in Physics & Chemistry
NXP Semiconductors today released its new LFPAK33 portfolio a range of high switching performance MOSFETs available in an ultra-reliable 3.3-mm x 3.3-mm power package. Unlike many MOSFET packages of this size, LFPAK33 has been designed from the ground up to be a tough power solution. Incorporating copper clip and solder die attach technologies, it features a market-leading junction temperature of 175 degrees Celsius. Nine LFPAK33 power MOSFET types are available immediately.