PVA Tepla, imec demonstrate 3D through-silicon via (TSV) void detection using GHz scanning acoustic microscopy
Thursday, January 17, 2013 - 07:00
in Physics & Chemistry
Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.